System anti electrostatic scheme for interconnection interface of Internet of things
System anti electrostatic scheme for interconnection interface of Internet of things
Guang Liang Hu
(Shenzhen tage Electronic Technology Co., Ltd. Shanghai 200114)
Abstract: Aiming at the electrostatic threat encountered in the production and use of Internet of things products, the lightning protection and anti-static protection schemes of various typical interfaces are enumerated.
Keywords: Internet of things, interface protection, anti-static, ESD
1., the necessity of anti-static products of Internet of things
As following the Internet, mobile Internet technology revolution after another wave of things (Internet of Things) has undoubtedly become a battleground in the scientific and technological industry.
Intelligent home appliances of the future, to provide you with fresh, seasonal food and how to cook food; intelligent Home Furnishing, automatically according to ambient light conditions, adjust brightness or change their color to change the mood; intelligent atmosphere control, through the learning habits of residents are most effective use of energy for heating or cooling; intelligent wear, can automatic advice according to the mood of clothing, read the health parameters, provide advice and diet fitness activities to help people get a better health indicators; intelligent vehicle and traffic system, improve traffic efficiency and comfort, make highway travel more secure.
The Internet of things products provide a variety of new applications to meet the needs of digital environmental monitoring, including our own monitoring. However, it is frequent communication everywhere interaction, or the communication between people and equipment, equipment in communication at the same time, the information channel also opens the door to electromagnetic interference, the electromagnetic interference is the most common threat of electrostatic. At any time, the cable is in contact with the connector, or a person touches an electronic system, and there is a possibility of a charge transfer, which then results in an electrostatic discharge process.
2. test standard for electrostatic discharge
Figure 1: ESD curve
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Human discharge model (HBM): the purpose of this standard is to simulate the electrostatic discharge process of the charged human body through the chip to the ground. It is mainly used for electrostatic testing in the process of manufacture and installation of chips. Although the HBM is usually sufficient for anti-static control of the environment in the factory, it does not apply to system level testing at all. The specific causes of ESD failures are mostly based on user wide use of the environment, various voltages and currents. For this reason, the industry uses different test standards for system level ESD testing, which is called IEC 61000-4-2.
IEC 61000-4-2: this standard is the goal of the human body in the simulation of charged users in the electrostatic environment release process, this is a system level ESD test, the purpose is to ensure the reliability of terminal products, this test that the user process, will not deliberately reduce static body, especially in the dry environment, the current commonly used standard test.
ISO 10605: this standard is for the automotive market and based on the simulation model of the human body in the car and the car from the outside into the electrostatic discharge process of automobile parts, meet this standard can ensure that the product is not the driver, vehicle loading static or technician body damage.
3. antistatic element characteristics
Antistatic elements (TVS/ESD) are very effective for ESD protection due to their inherent electrical parameter characteristics, and TVS/ESD components have several key parameters:
Transient suppression diode (Transient Voltage Suppressor) referred to as TVS/ESD, is a high performance protection device a diode, using reverse breakdown principle of P-N node, the static pressure pulses into the ground, so as to protect the internal components of the electrostatic sensitive electrical appliances. With the TVS/ESD diode as an example: when the instantaneous voltage exceeds the normal working voltage circuit, TVS/ESD diode is an avalanche, providing instantaneous current of a low resistance path, the result is the instantaneous current through the diode is away, away from the protected device and the voltage recovery of normal value before the protected circuit has been cut-off voltage. When the instantaneous pulse is over, the TVS/ESD diode automatically returns to the high impedance state and the entire loop enters the normal voltage.
TVS/ESD has two kinds of unidirectional and bidirectional. The characteristics of unidirectional TVS/ESD diode are similar to that of Zener diode. The characteristics of bidirectional TVS/ESD are equivalent to two diode diodes in reverse series. The characteristics of I-V curve are shown in figure 2:
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Reverse reverse voltage (cut-off voltage) VRWM and reverse leakage current IR: reverse breaking voltage (cut-off voltage) VRWM represents the maximum voltage at which the TVS diode is not connected. At this voltage there is only a small reverse leakage current of IR.
Breakdown voltage VBR:TVS/ESD through the specified test current IT voltage, which is indicative of the TVS tube conduction voltage.
The pulse peak current IPP:TVS/ESD maximum peak current 10/1000 S wave through the (peak current 8/20 S wave is about 5 times, the 8/20 s is defined as the IPP pulse current, please refer to figure 3), more than the current value may cause permanent damage. In the same series, the higher the breakdown voltage, the smaller the peak current allowed to pass through the pipe.
The voltage at which the maximum clamp voltage VC:TVS/ESD flows across the pulse peak current IPP.
Forward conduction voltage VF:TVS/ESD, voltage through forward conduction current IF.
Figure 3: surge 8/20 mu S current waveform
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Understanding the characteristics of the TVS/ESD curve, it is clear that the task of TVS/ESD is to occur ESD event, the input voltage is maintained within the safe overvoltage range, and in normal operation does not affect system performance. The TVS/ESD is placed adjacent to the ESD event and may enter the system position to limit the voltage at the sensitive node and lead the current to a less sensitive node, such as the ground level. To achieve this function, the ESD diode must have high impedance in normal working voltage range, low impedance in addition to the normal working voltage range, so as to be directly from the current sensitive nodes off, and limit the transient voltage, so as to guarantee that the system of anti-static reliability.
4. antistatic circuit design
4.1 parallel ESD protection device at the interface of the circuit
As shown in Figure 4, the most effective way is at the entrance of the parallel ESD diode interface, because ESD clamp characteristics in electrostatic discharge, electrostatic peak voltage is ESD diode clamp pressure within the specified scope, to ensure stable operation of the rear chip.
Figure 4:ESD diode operation principle
4.2 select the appropriate ESD protection device in the circuit
Select ESD electrostatic protection device, note:
Do not exceed the maximum allowable voltage clamping voltage protected device, circuit voltage does not exceed the device operating voltage protection, low capacitance, leakage flow may reduce interference and loss.
4.3 ESD protection device in the circuit location and ground wire settings
(1) the electrostatic protection device shall be installed as close as possible to the electrostatic input, away from the protected device;
(2) the earth wire that the ESD protection device must connect is not the digital earth wire;
(3) the line to the ground is as short as possible, and the distance between the electrostatic protection device and the protected line is as short as possible;
(4) try to avoid being protected and not protected line side by side line.
5. electrostatic protection case of Internet of things interface
Because of things many products, a variety of sensor signal acquisition and diversity, the main chip data processing and transmission are different, the company has developed a protection device for a variety of communication interface, also can choose single products according to the needs of the board.
5.1 Internet of things interface speed, parasitic capacitance and corresponding ESD protection device list
Things different requirements on the circuit parasitic capacitance of communication interface with different rates based on ESD and its parasitic capacitance diode is inevitable, so in different communication interfaces when selecting ESD parasitic capacitance value of the products need to pay special attention to the following list, the type used for various communication interfaces and restrictions on ESD consolidation rate the capacitance of the diode and protection scheme for communication interface.
序號 |
接口名稱 |
傳輸速度(Mbit/S) |
對電路寄生電容要求(pf) |
推薦保護器件 |
一級保護 |
二級保護 |
三級保護 |
1 |
USB2.0接口 |
480 |
<3 |
|
|
SR05/SRV05-4 |
2 |
USB3.0接口 |
4800 |
<1 |
|
|
LC05CD |
3 |
USB3.1接口 |
10000 |
<0.5 |
|
|
ULC3324P10
ULC052010P5 |
4 |
TYPE-C接口 |
10000 |
<0.5 |
|
|
ULC3324P10
ULC052010P5 |
5 |
快充USB接口 |
480 |
<3 |
|
|
ULC1654N |
6 |
快充電源接口 |
- |
- |
|
|
ESD1285P |
7 |
100M網絡接口 |
100 |
<5 |
3R090-5S |
HL60-025 |
SLVU2.8-4/SRV05-4 |
8 |
1000M網絡接口 |
1000 |
<1 |
3R090-5S |
HL60-025 |
LC3311CCW |
9 |
10000M網絡接口 |
10000 |
<1 |
3R090-5S |
HL60-025 |
ULC0542T |
10 |
POE網絡接口 |
100 |
<5 |
3R090-5S |
HL60-025 |
SLVU2.8-4
SMCJ68CA |
11 |
HDMI1.3接口 |
10200 |
<1 |
|
|
ULC0524P |
12 |
HDMI1.4接口 |
10200 |
<1 |
|
|
ULC0524P |
13 |
HDMI2.0接口 |
18000 |
<0.5 |
|
|
ULC0514P10
ULC0544P10 |
14 |
DISPLAY視頻接口 |
5400 |
<1 |
|
|
ULC0524P |
15 |
VGA模擬視頻接口 |
162 |
<1 |
|
|
ULC0524P |
16 |
DVI數字視頻接口 |
3960 |
<1 |
|
|
ULC0544M |
17 |
Audio音頻接口 |
1.5 |
<100 |
|
|
SDA05W5/ULC0511CDN |
18 |
LVDS接口 |
655 |
<10 |
|
|
ULC0524P |
19 |
SIM卡接口 |
7.2 |
<10 |
|
|
SRV05-4 |
20 |
SD卡接口 |
10 |
<10 |
|
|
SRV05-4 |
21 |
MMC卡接口 |
10 |
<10 |
|
|
SRV05-4 |
22 |
E-SATA接口 |
6000 |
<1 |
|
|
ULC0524P |
23 |
I2C接口 |
3.4 |
<100 |
|
|
SDA05CW
SD05C |
24 |
T1 E1接口 |
1.544 |
<100 |
P2300SC |
HL250-120 |
SRV05-4 |
25 |
RS232接口 |
0.2 |
<50 |
|
|
SD12C
SMC12 |
26 |
RS485接口 |
10 |
<50 |
3R090-5S |
SMD1812P050TF |
SM712 |
27 |
CAN總線接口 |
1 |
<50 |
3R090-5S |
SMD1812P050TF/24 |
SMC24
SD24C |
28 |
LIN總線接口 |
1 |
<50 |
3R090-5S |
SMD1812P050TF |
SMC24
SD24C |
29 |
xDSL接口 |
2 |
<100 |
|
|
SR70 |
30 |
RF /GPS天線接口 |
1000 |
<1 |
SMD4532-090 |
|
ULC0511CDN |
31 |
GPIO接口 |
5 |
<100 |
|
|
SDA05W5
SD05C |
32 |
5V直流電源接口 |
- |
<1000 |
|
|
SMBJ5.0CA
SMCJ5.0CA |
33 |
12V直流電源接口 |
- |
<1000 |
|
|
SMBJ12CA
SMCJ12CA |
34 |
48V電源接口 |
- |
<1000 |
|
|
SMCJ48CA |
35 |
12V汽車電源口 |
- |
<1000 |
|
|
SMCJ22CA
SM8S22A |
36 |
24V汽車電源口 |
- |
<1000 |
|
|
SMCJ36CA
SM8S36CA |
37 |
220V交流電源接口 |
- |
<1000 |
2R600-8L |
20D561KJ |
|
A variety of networking interfaces listed in the table, a tage electrostatic protection scheme corresponding interface, convenient reference design, if necessary, please contact the author.
6., Internet of things interface, electrostatic protection, development direction
Internet communications networking industry help arranged in a crisscross pattern, 4 and 5 industrial air plant for faster, more stable, and more simple. Typical interconnection interfaces and IC continue to come out of the old, the pursuit of smaller size, more lines, more sophisticated. Anti electrostatic ESD follow the evolution of the interface IC, do the corresponding match, ESD volume will become smaller, lower capacitance, anti surge ability more flexible line more flexible.
Reference
[1] PCB anti ESD design authors: Jiang Airu
ESD protection design for [2] electronic communication products: Wang Yuanyuan, Zhang Yao
[3] EMC baiwenbaida Author: Xu Qianghua
Author: Hu Guangliang, senior engineer, engaged in research and development of ESD components and circuit anti-static design!